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How do hyperdispersants for electronic pastes reduce the viscosity of electronic pastes and improve coating performance?

Publish Time: 2024-12-05
Electronic paste is a complex material mixed with nano- or micron-sized metal particles, organic carriers and solvents. It is widely used in printed electronics, photovoltaic cells, sensors and other fields. The quality of its coating performance directly affects the performance of the final product. Hyperdispersants for electronic pastes play a key role in this process, mainly reducing the viscosity of electronic pastes and improving coating performance through the following aspects:

1. Interface control and stabilization

Hyperdispersants for electronic pastes usually have an amphiphilic molecular structure, with a hydrophilic group on one end and a hydrophobic group on the other. These molecules can be adsorbed on the surface of metal particles, forming a protective layer that effectively prevents direct contact and agglomeration between particles. In this way, hyperdispersants for electronic pastes reduce friction within the paste, thereby reducing viscosity.

2. Reduce surface energy

Hyperdispersants for electronic pastes can significantly reduce the surface energy of metal particles, weakening the mutual attraction between particles. This reduction in surface energy facilitates the uniform dispersion of particles in the slurry and avoids an increase in viscosity due to particle aggregation.

3. Hedging of thickening effect

Some hyperdispersants for electronic pastes have a thickening effect and can maintain the fluidity of the slurry without making it too viscous when added in appropriate amounts. This effect can be achieved by adjusting the molecular weight and concentration of hyperdispersants for electronic pastes, allowing the pastes to have better fluidity and coating properties during the coating process.

4. Rheological performance optimization

Hyperdispersants for electronic pastes can significantly change the rheological properties of electronic pastes, allowing them to exhibit better rheological behavior under shear stress. Specifically, hyperdispersants for electronic pastes can convert the slurry from a Newtonian fluid to a non-Newtonian fluid, making it less viscous at high shear rates, making it easier to flow and spread during the coating process.

5. Wettability of solvent and carrier

Hyperdispersants for electronic pastes can improve the wettability of solvents and organic carriers to the particle surface, making it easier for particles to be dispersed into solvents. This improved wettability contributes to an even distribution of particles, thereby reducing the overall viscosity of the slurry.

6. Prevent settlement and stratification

By effectively dispersing particles, hyperdispersants for electronic pastes can prevent particles in the slurry from settling and delaminating, maintaining the stability of the slurry over time. This stability helps maintain consistent viscosity and coating performance during the coating process.

7. Improvement of coating performance

In practical applications, while reducing viscosity, hyperdispersants for electronic pastes can also improve the coating performance of electronic pastes, including coating uniformity, thickness control and surface smoothness. The improvement of these properties enables the coated products to have better electrical and mechanical properties.

Hyperdispersants for electronic pastes effectively reduce the viscosity of electronic pastes and improve their coating performance through various mechanisms, including interface regulation, reducing surface energy, optimizing rheological properties, improving wettability and preventing settling. These technical means make the application of electronic pastes in printed electronics, photovoltaic cells and other fields more extensive and efficient.
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